The original sensor design has functioned well, but a next-gen redesign offered opportunities for cost reduction and SKU reduction through a more universal fit across helmet models/sizes. I performed the engineering work and interacted with the client and vendors to implement this redesign.
The housings were redesigned to eliminate brass inserts and gasketed screws in favor of snaps. This greatly reduces part count and allows for process tools that can open and close the housings for assembly and servicing with press-mounted tools instead of torque drivers, saving significant time and effort at the contract manufacturer. Gaskets are designed to be molded directly onto the housings, eliminating assembly steps.
PCBA connection redesign
The crimp connector on the sensor and mating PCBA header were replaced with a direct connection of printed silver ink traces to the PCBA pads via a clamping bar. This connection provides improved strain relief while being fully serviceable.
Laminated sensor pad redesign
The laminated sensor pad layout and stackup was redesigned to eliminate materials and greatly improve both material utilization and helmet integration.